AMD Announces Radeon RX 6600XT, Reveals Q2 Results, and Intel Shares Roadmap News


This 7 days has experienced extra than just gaming information, and with the importance of these announcements, I thought it acceptable to share a individual news item for them than placing the information at the bottom of the gaming information item.

Going in alphabetical purchase, AMD introduced the Radeon RX 6600XT this 7 days, focusing on superior-frame charge 1080p gaming. It utilizes the RDNA 2 architecture like the relaxation of the RX 6000 collection but is a more compact chip, offering only 32 MB of Infinity Cache. For VRAM it has 8 GB of GDDR6 related on a 128 little bit interface. AMD is proclaiming the GPU with its 32 Compute Units, 2589 MHz maximum boost clock and 2359 MHz Sport Clock enables it to be 15% more rapidly, on normal, with highest configurations as opposed to the RTX 3060. Its full board electricity is said as commencing at 160 W, which should really translate to a solitary 8-pin connector as that gives 150 W and the PCIe slot can offer 75 W, however we will have to see what the AIB companions put together.

AMD expects ASRock, Asus, Biostar, Gigabyte, MSI, PowerColor, Sapphire, XFX, and Yeston to have playing cards out there on August 11. The prompt rate is $379, but taking into consideration the latest condition of the GPU industry, we will just have to see if any basically sell at that.

Supply: AMD [1] (Radeon RX 6600XT)

This week AMD also shared its Q2 economical benefits and with that info it is not way too astonishing that the stock value reached a new greatest of about $100 a share. According to the results, the calendar year-around-calendar year enhance to Q2 earnings was 99% and gross financial gain increased 116%. The firm obviously experienced an superb next quarter this yr and the expectation is now to reach 60% calendar year-more than-year yearly income expansion thanks to “powerful execution and amplified consumer desire” for AMD’s solutions. I identify economic facts could possibly not be of individual desire, but it is a somewhat significant achievement taking into consideration 6 decades back AMD inventory was valued at below $two. Of class Intel has not been having the greatest six decades, but it is functioning on switching that.

Supply: AMD [2] (Q2 2021 Financial Outcomes)

Intel uncovered this week its roadmap for its potential process and packaging systems that will electricity its products by 2025 and beyond. Between these new systems is RibbonFET, a gate-all-around transistor style and design that should permit quicker switching speeds though taking up a lot less place in comparison to the existing FinFET style and design. Although the FinFET style has the transistor gate crossing about the channel, manufacturing a 3D design that surpassed common planar CMOS styles prior to it. With RibbonFET the channels or ribbons are accomplished surrounded by the gate, rising the success of the gate devoid of growing the footprint associated.

Also on the roadmap is PowerVia which significantly adjustments the design and style for power supply in a processor. Alternatively of obtaining the power routing on the entrance aspect of the wafer, together with the various wires connecting the caches, buffers, and accelerators, this structure sites the electric power on the bottom of the wafer. This ought to improve signal transmission by reducing the interference from the energy flowing so around the info alerts.

Intel also announced it will be the initially to acquire a Large Numerical Aperture EUV output resource from ASML, which has the potential to drive beyond some of the boundaries of present EUV production instruments. As is stated in the Anandtech write-up connected to down below, this will improve the electric power of the laser utilized for the etching system, which in transform enhances the precision of the printed traces. Growing the patterning can accomplish this effect as properly, but at the charge of yields so this option would enable solitary-patterning to go on for longer.

The firm has also renamed its process nodes to be Intel 7 for the recent process that will deliver Alder Lake this year, Intel four, getting into manufacturing H2 2022, Intel three, H2 2023, Intel 20A, 2024, and then Intel 18A in early 2025. It is worth noting Intel has dropped the nanometer unit from these internet marketing names, although the A implies angstroms (one particular purchase of magnitude more compact than nanometers), and this does make some perception as these are not correct actual physical measurements. That is legitimate for other manufacturers as properly, with 7 nm processes not always producing attributes that little, but relatively they are an improvement about the prior know-how.

For packaging systems, Intel introduced Foveros Omni and Foveros Direct that are both of those relatively substantial. With Foveros Omni, Intel is claiming unbounded overall flexibility by allowing die disaggregation as leading and foundation die tiles can be mixed throughout nodes and the top rated tiles can even be broader than the foundation tiles. Generally you would expect the top to be as significant or lesser than the foundation, but this know-how enables copper columns to be developed up, connecting the leading dies specifically to the substrate devoid of vias as a result of the foundation die. Foveros Immediate is copper-to-copper bonding, effectively instantly connecting two dies and it enables sub-10 micron bump pitches. If this appears acquainted, TSMC has its personal Chip-on-Wafer or Wafer-on-Wafer process that equally stacks dies together, but no matter of the organization it is an attention-grabbing and remarkable technology, particularly as corporations shift to multi-chip models.

Source: Intel (Course of action and Packaging Roadmap) and Anandtech

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